ISO 9453:1990
Soft solder alloys — Chemical compositions and forms
Soft solder alloys — Chemical compositions and forms
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Soft solder alloys — Chemical compositions and forms
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
| Edition | 1990 |
|---|---|
| Published Date | 1990 |
| Published By | International Standardization Organisation |
| Page Count | 4 |