ISO 9453:2006

Soft solder alloys — Chemical compositions and forms

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

• tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
• tin-antimony;
• tin-bismuth;
• tin-copper, with and without silver;
• tin-indium, with and without silver and bismuth;
• tin-silver, with and without copper and bismuth;
• tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

Edition	2006
Published Date	2006
Published By	International Standardization Organisation
Page Count	10