ISO 9453:2020

Soft solder alloys — Chemical compositions and forms

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Edition	2020
Published Date	2020
Published By	International Standardization Organisation
Page Count	13